 CHINAFIX CF360 intelligent mute BGA chip repair machine (Offer to Sell)
Trade Lead Description:
Solder Type: Leaded Solder / Lead Free
SMD Type: Micro bga, BGA, CSP, QFP
PCB Thickness:0.5mm~4mm
PCB Size:W50mm*D50mm~W455*D350mm
Heating Mode/Power (Upper):Hot-blast air /800W
Heating Mode/Power (Bottom):Hot-blast air /800W
Preheating Mode/Power: IR / 2400W
PCB Location Mode: Shape or Tongs
Drive Mode: Gear, Rack
Control / Adjusting Mode: Temperature control instrument
Temperature Range: Room Temperature 0~400°C
Max Power:4000W
Supply Volt:110V/220V
Machine Dimension:760mm (L) *700mm (W) *600mm (H)
Weight:36KG
CF360 characteristic:
1, The hot-air part adopts exported long-life heating coil, through special insulation heating treatment, heating uniformlier, long-life to use well.
2, The design of three warm areas support, can fine adjust to support height, avoid welding-area to sink.
3. The upper hot air-flow can be adjusted, use different air-flow to different chips, it's not easy to make expand.
| Type of Offer: |
Offer to Sell |
| Quantity: |
1 |
| Packaging: |
Packed by thick wooden box |
| Price / Incoterms Conditions: |
Not Specified |
Posted from China - Guangdong on 11 January, 2014
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