 Cluster system for Oxide and Metal sputtering (Offer to Sell)
Trade Lead Description:
Metal, ceramic, and alloy depositions for R&D in OLED fields.
Special Features
Cluster sputtering system for TCO deposition with two sputtering chambers and one glove box.
Robot transfer chamber between chambers and glove box.
Cassette loading type with glass holder.
Three tiltable 8" sputter guns and extra sputter gun ports in each chamber.
Available in multilayer deposition as well as co-deposition.
Automatic control in substrate rotation and substrate to cathode distance.
Precision mask aligner with laser focusing.
Substrate temperature uniformity: <±2% over 200x200 glass.
System operation by PLC-based PC control.
Specifications
Glass Capacity: 5 × 200 (mm3)
Dimension: 3,500L × 2,400H × 3,300W (mm3)
Power: AC 220V, three phase for main
RF 3,000W 2set for sputtering
DC 5,000W 2set for sputtering
Heater: SiC coated graphite (Max. 600°C)
Gas: Ar/N2/O2/H2/C2H2
Pump: rotary (1,000l/min) & TMP (400l/s) for transfer chamber
turbo (2,400l/s, 2set) & dry pump (1
| Type of Offer: |
Offer to Sell |
| Quantity: |
Not Specified |
| Packaging: |
Not Specified |
| Price / Incoterms Conditions: |
Not Specified |
Posted from Korea, South - Inch'on-gwangyoksi on 4 October, 2012
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